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High-Frequency
CTE Solutions

Interposers
Up to 300mm
Our interposers are engineered to address CTE (coefficient of thermal expansion) issues in large electronic devices by using column structures that are designed to tilt independently and make non-slip contact. This helps to reduce stresses and deformations caused by the CTE difference between the test device and the PCB. Our interposers are capable of supporting even the largest electronic devices, including 300mm wafer devices.
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